Manufacturer Part Number
BQ25713RSNR
Manufacturer
Texas Instruments
Introduction
The BQ25713RSNR is a multifunctional battery management chip designed for efficient power management across various battery chemistries in electronic devices.
Product Features and Performance
Monitors battery status effectively
Supports multi-chemistry batteries including Li-Ion, NiCd, NiMH
Can manage 1 to 4 battery cells
Embedded over current, over temperature, and over voltage protection
Utilizes I2C interface for communication
Suitable for operation in a wide temperature range from -40°C to 85°C
Designed for surface mount technology
Product Advantages
Advanced battery monitoring capabilities
High compatibility with various battery chemistries
Integrated fault protection features enhance device safety
Efficient communication via I2C interface
Key Technical Parameters
Battery Chemistry: Multi-Chemistry
Number of Cells: 1 ~ 4
Fault Protection: Over Current, Over Temperature, Over Voltage
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-WFQFN Exposed Pad
Supplier Device Package: 32-QFN (4x4)
Quality and Safety Features
Fault protection mechanisms prevent damage due to abnormal conditions
Robust construction suited for varying environmental conditions
Compatibility
Compatible with multi-chemistry battery types
Universal I2C interface support
Application Areas
Suitable for portable electronic devices
Ideal for computing device power management
Appropriate for both consumer and industrial applications
Product Lifecycle
Product status is Active
No announced discontinuation, ensuring long-term availability
Continued support and likely upgrades or replacements available
Several Key Reasons to Choose This Product
Supports a broad range of battery chemistries making it versatile
Comprehensive fault protection increases overall device reliability and safety
Capable of managing multiple cells, favorable for various application scales
High temperature operating range ensuring performance stability in different environments
Compact, surface-mount packaging simplifies the integration into design