Manufacturer Part Number
74AC11244DBR
Manufacturer
Texas Instruments
Introduction
The 74AC11244DBR is designed by Texas Instruments as part of their 74AC series, serving as a logic buffer, non-inverting, to ensure signal strength in high-speed and general applications.
Product Features and Performance
High-speed logic buffer, non-inverting.
Features two elements with four bits per element.
Offers 3-State outputs for connection to a bus or for reducing power consumption.
Capable of driving 24mA both in high and low states.
Operates over a wide supply voltage range from 3V to 5.5V.
Designed for surface mount technology with a 24-SSOP package.
Product Advantages
Ensures signal integrity in complex high-speed circuits.
Versatile with 3-state outputs for bus-driven applications.
High drive capability supports multiple loads.
Wide operating voltage range accommodates various power systems.
Suitable for surface mounting, optimizing board space.
Key Technical Parameters
Logic Type: Buffer, Non-Inverting.
Number of Elements: 2.
Number of Bits per Element: 4.
Current Output High, Low: 24mA.
Voltage Supply: 3V ~ 5.5V.
Operating Temperature: -40°C ~ 85°C (TA).
Quality and Safety Features
Manufactured by Texas Instruments, ensuring high reliability and adherence to safety standards.
Compatibility
Broad compatibility due to the 3-state output feature.
Integrates smoothly with both 3V and 5.5V systems.
Application Areas
High-speed data transmission systems.
Digital signal buffering and amplification.
Microcontroller interface.
Communication systems.
Portable and consumer electronics.
Product Lifecycle
Status: Active, indicating ongoing manufacturing and support.
No immediate indication of discontinuation, with support and replacements available.
Several Key Reasons to Choose This Product
High reliability and performance from Texas Instruments.
Versatile application range from consumer electronics to high-speed communication systems.
Broad compatibility with various systems due to its wide supply voltage range and 3-state outputs.
High drive capability facilitating multiple load operations.
Surface mount package optimizes PCB space efficiency.