Manufacturer Part Number
LFXP6C-4FN256I
Manufacturer
Lattice Semiconductor
Introduction
Lattice XP FPGA for embedded applications with advanced security features
Product Features and Performance
6000 logic elements/cells for flexible logic implementation
73728 total RAM bits for data storage
188 I/O pins for extensive connectivity options
71V to 3.465V supply voltage range for various power environments
Surface mount, 256-BGA packaging for compact design integration
Supports operating temperatures from -40°C to 100°C for harsh environments
Product Advantages
Offers non-volatile technology with instant-on capabilities
In-system programmable with encryption for secure updates
TransFR technology for fault-resilient field updates
Pre-engineered source-synchronous I/O support to simplify interface design
Key Technical Parameters
Number of Logic Elements/Cells: 6000
Total RAM Bits: 73728
Number of I/O: 188
Voltage - Supply: 1.71V ~ 3.465V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FPBGA (17x17)
Quality and Safety Features
Lead-free and RoHS compliant for environmental safety
100% factory-tested for reliability and long-term performance
Compatibility
Compatible with Lattice Diamond design software for development
Supports common industry-standard IP cores and reference designs
Application Areas
Ideal for a range of applications including automotive, industrial, communications, and consumer electronics
Product Lifecycle
Obsolete status, consult manufacturer for replacement or upgrade options
Several Key Reasons to Choose This Product
Non-volatile configuration memory eliminates the need for external configuration devices
Live update technology enables design changes without system downtime
Single-chip, high-security solution reduces the risk of external attacks
Unique encryption capabilities for secure intellectual property protection
Advanced I/O features designed for improved system integration and performance