LFXP3C-3Q208C - Lattice Semiconductor Corporation

Manufacturer Part Number

LFXP3C-3Q208C

Manufacturer

Lattice Semiconductor

Introduction

LFXP3C-3Q208C is part of the XP series FPGA, designed for high performance in embedded applications with a flexible and programmable architecture.

Product Features and Performance

3000 logic elements/cells for complex logic implementation.

55296 total RAM bits for effective data handling and processing.

136 input/output ports facilitating robust connectivity options.

Operates on a voltage supply ranging from 1.71V to 3.465V.

Surface mount 208-BFQFP package ensures a compact footprint.

Product Advantages

Suitable for high-integration embedded systems due to high number of logic cells.

Increased design flexibility with extensive RAM and I/O options.

Low to moderate power requirements accommodating various power supplies.

Key Technical Parameters

Number of Logic Elements/Cells: 3000

Total RAM Bits: 55296

Number of I/O: 136

Voltage Supply: 1.71V ~ 3.465V

Mounting Type: Surface Mount

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Robust physical package (208-BFQFP) providing physical integrity and protection.

Operational within a wide temperature range ensuring reliability in varying environmental conditions.

Compatibility

Compatible with various voltage supplies and design environments due to its versatile power requirements and mount type.

Application Areas

Suited for embedded systems within automotive, telecommunications, and consumer electronics industries.

Product Lifecycle

Currently listed as Obsolete, suggesting discontinuation with limited or no direct replacements or upgrades available.

Several Key Reasons to Choose This Product

High logic capacity and memory for complex embedded designs.

Broad range of I/O options enhancing interfacing and connectivity capabilities.

Versatile voltage supply compatibility, making it suitable for various applications.

Operable across a wide temperature range, ensuring reliability in diverse operating conditions.

Compact and durable 208-BFQFP packaging fits well in space-constrained applications.