Manufacturer Part Number
LFXP2-8E-5MN132C
Manufacturer
Lattice Semiconductor
Introduction
The LFXP2-8E-5MN132C is an embedded FPGA from Lattice Semiconductor's XP2 series, designed for flexibility in a range of embedded applications.
Product Features and Performance
1000 LABs/CLBs for logical function implementation
8000 Logic Elements/Cells for efficient circuit design
226304 Total RAM Bits offering significant onboard memory
86 I/O Pins for interfacing with peripherals
14V ~ 1.26V Supply Voltage Range for low power operation
Surface Mount Technology for modern PCB design
0°C ~ 85°C Operating Temperature Range ensuring reliability across various environments
132-LFBGA, CSPBGA Package for compact footprint
132-CSBGA (8x8) Supplier Device Package for streamlined integration
Product Advantages
Highly configurable for versatile use cases
Low power consumption for energy-efficient designs
Ample I/O and memory for complex projects
Robust operating temperature for use in industrial applications
Compact form for space-sensitive devices
Key Technical Parameters
Number of LABs/CLBs: 1000
Number of Logic Elements/Cells: 8000
Total RAM Bits: 226304
Number of I/O: 86
Voltage - Supply Range: 1.14V ~ 1.26V
Operating Temperature Range: 0°C ~ 85°C
Package / Case: 132-LFBGA, CSPBGA
Quality and Safety Features
Active Product Status indicating manufacturer support
Compliance with industry-standard safety and environmental regulations
Compatibility
Designed for integration into a variety of circuit boards with standard surface mount technology
Application Areas
Consumer Electronics
Automotive
Telecommunication Infrastructure
Industrial Control Systems
Medical Devices
Product Lifecycle
Active status with ongoing manufacturer support
Not reported as nearing discontinuation
Replacements or upgrades may be available as newer FPGA models are introduced
Several Key Reasons to Choose This Product
Versatility and high-level of integration for embedded systems
Low power design for battery-powered applications
Ample logic resources allowing for a wide range of applications
Suitable for mass production due to Active status and availability in tray packaging
Industry-standard packaging for compatibility with modern PCB assembly processes
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