Manufacturer Part Number
LFE5U-25F-7BG256I
Manufacturer
Lattice Semiconductor
Introduction
High-performance, programmable FPGA chip for embedded solutions
Product Features and Performance
Embedded FPGA with 24000 Logic Elements/Cells
6000 Logic Array Blocks (LABs)/CLBs
1,032,192 Total RAM Bits for data storage
197 Input/Output pins for connectivity
Low power consumption with a supply voltage range of 1.045V to 1.155V
Surface Mount technology for PCB assembly
Reliable performance with operating temperature from -40°C to 100°C (TJ)
Product Advantages
Scalable and energy-efficient FPGA design
Ample logic and memory resources for complex applications
Extensive I/O count for versatile interfacing
Compact 256-LFBGA package saves board space
High-temperature tolerance ensuring durability
Key Technical Parameters
Number of LABs/CLBs: 6000
Number of Logic Elements/Cells: 24000
Total RAM Bits: 1032192
Number of I/O: 197
Voltage Supply: 1.045V ~ 1.155V
Operating Temperature: -40°C ~ 100°C (TJ)
Package/Case: 256-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 256-CABGA (14x14)
Quality and Safety Features
Robust construction for industrial environments
Compliance with safety and quality standards
Extended temperature range for high-reliability applications
Compatibility
Compatible with a wide range of peripheral and interface standards
Versatile I/O structure for various design requirements
Application Areas
Telecommunications
Industrial control systems
Embedded computing
Internet of Things (IoT) devices
Consumer electronics
Product Lifecycle
Product status is Active
No indications of end-of-life or discontinuation
Availability of replacements or upgrades as part of the ECP5 series
Several Key Reasons to Choose This Product
High logic and memory resource count for advanced processing capabilities
Ideal for power-sensitive applications due to low operating voltage
Superior I/O count for extensive external interfacing
Robust temperature range suitable for harsh environments
Part of the reputable ECP5 series known for performance and reliability
Compact packaging for space-constrained applications
Long product lifecycle with active status, reducing the risk of premature obsolescence