Manufacturer Part Number
LFE3-17EA-6FTN256C
Manufacturer
Lattice Semiconductor
Introduction
The Lattice ECP3 series FPGA offers a versatile and customizable solution for embedded system design.
Product Features and Performance
2125 LABs/CLBs for flexible logic implementation
17000 Logic Elements/Cells
Total RAM Bits of 716800 providing ample memory resources
133 input/output pins for wide interfacing capability
Low power consumption with supply voltage from 1.14V to 1.26V
Surface mount 256-BGA package for compact board design
Operating temperature range from 0°C to 85°C supporting varied environmental conditions
Product Advantages
High logic density for complex application implementations
Efficient power usage suitable for power-sensitive designs
Robust temperature range ensures performance in different operating conditions
User-configurable technology for specific application needs
Easy to mount with surface mount technology
Key Technical Parameters
Number of LABs/CLBs: 2125
Number of Logic Elements/Cells: 17000
Total RAM Bits: 716800
Number of I/O: 133
Voltage Supply: 1.14V ~ 1.26V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Package / Case: 256-BGA
Supplier Device Package: 256-FTBGA (17x17)
Quality and Safety Features
Complies with industry standards for embedded FPGAs
Rigorous testing for quality assurance
Design and manufacturing processes aimed to maximize reliability
Compatibility
Compatible with standard surface mount technology and PCB design practices
Can be interfaced with a wide range of digital components due to versatile I/O voltage levels
Application Areas
Telecommunication infrastructure
Automotive electronics
Industrial automation
High-speed networking equipment
Consumer electronics
Product Lifecycle
Product Status: Active
The part is currently sourced and available, with no immediate discontinuation notices, replacements, or upgrades announced.
Several Key Reasons to Choose This Product
Versatility in application due to a large number of LABs/CLBs and logic elements
Suitable for power-constrained applications with its low operating voltage range
Reliable performance even in extended temperature environments
Easy integration given the industry-standard package and surface mount technology
Continued product support and availability ensuring long-term deployment