LFE3-150EA-7FN1156I - Lattice Semiconductor Corporation

Manufacturer Part Number

LFE3-150EA-7FN1156I

Manufacturer

Lattice Semiconductor

Introduction

The LFE3-150EA-7FN1156I is a high-performance, programmable Field Programmable Gate Array (FPGA) suitable for multifarious applications due to its flexibility and feature set.

Product Features and Performance

Embedded FPGA (Field Programmable Gate Array)

149,000 logic elements/cells

18,625 LABs/CLBs

Total RAM Bits: 7,014,400

586 I/O pins

Supports voltage supply from 1.14V to 1.26V

Operates within a temperature range of -40°C to 100°C

Mounting Type: Surface Mount

Package/Case: 1156-BBGA with a device package of 1156-FPBGA (35x35)

Product Advantages

Ability to handle complex logic functions with a large number of logic elements and LABs

High I/O pin count for extensive interfacing capabilities

Flexibility with programmable features allowing for application-specific customization

robust thermal and power handling characteristics

Key Technical Parameters

Number of Logic Elements/Cells: 149,000

Number of LABs/CLBs: 18,625

Total RAM Bits: 7,014,400

Number of I/O: 586

Supply Voltage: 1.14V ~ 1.26V

Operating Temperature: -40°C ~ 100°C

Quality and Safety Features

Secure against a wide range of operational temperatures from -40°C to 100°C ensuring reliability in adverse conditions.

Compliant with standard power supply safety measures

Compatibility

Compatible with other devices and peripherals that support similar voltage levels and I/O interface standards.

Application Areas

Telecommunications

Industrial automation

Consumer electronics

Automotive industry

IoT devices

Product Lifecycle

Currently active status with no indication of nearing discontinuation.

Upgrades and replacements are available as part of the ongoing ECP3 series product line development.

Several Key Reasons to Choose This Product

High logic density and capacity offering scalability for complex applications.

Broad temperature and voltage operation ranges making it suitable for harsh environments.

Advanced packaging technology enables effective heat dissipation and reliable physical integration.

High number of I/O promotes richer interfacing with multiple peripherals and systems.

Ongoing product support and potential for future upgrades within the Lattice Semiconductor portfolio.