Manufacturer Part Number
THGBMJG8C4LBAU8
Manufacturer
Toshiba Memory America
Introduction
The THGBMJG8C4LBAU8 is a high-capacity e•MMC™ FLASH memory product designed for advanced memory solutions.
Product Features and Performance
Non-Volatile FLASH memory
Memory size of 256Gbit
Organized as 32G x 8
Uses FLASH - NAND Technology
Memory Interface: eMMC
Operates between -40°C ~ 105°C
Surface Mount, 153-WFBGA package
Product Advantages
High storage capacity
Reliable data retention in extreme conditions
Compact and robust package design
Key Technical Parameters
Memory Size: 256Gbit
Memory Organization: 32G x 8
Technology: FLASH - NAND
Temperature Range: -40°C ~ 105°C
Case: 153-WFBGA
Quality and Safety Features
Operational across a wide temperature range: -40°C to 105°C
Compatibility
Compatible with various applications requiring embedded memory solutions, where eMMC interface is required.
Application Areas
Mobile devices
Consumer electronics
Automotive applications
Industrial systems
Product Lifecycle
Status: Active
No indication of discontinuation; replacements or upgrades available as newer memory technologies evolve.
Several Key Reasons to Choose This Product
High-density memory storage of 256Gbit
Durability in extreme temperature conditions
Robust surface mount package suitable for dense PCB layouts
Reliable supplier with consistency in product quality and support
Optimized for high-speed and efficiency in data handling and storage.
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