Manufacturer Part Number
NJU39612E2
Manufacturer
RICOH
Introduction
The NJU39612E2 is an integrated circuit designed for power management, focusing on motor driving applications, and falls within the category of PMIC Motor Drivers, Controllers.
Product Features and Performance
Power Management IC (PMIC) for motor driving
Designed to control stepper motors
Bipolar stepper motor compatibility
Functions include commutation and direction management
Pre-Driver - Half Bridge output configuration for controlling motor phases
Parallel interface for communication with microcontrollers or other ICs
Accommodates microstepping for precise motor control (>256 Microsteps)
Product Advantages
High integration facilitates compact motor control designs
Precision control enables smooth and accurate stepper motor operation
Customizable settings via parallel interface to suit various application needs
Key Technical Parameters
Motor Type - Stepper: Bipolar
Step Resolution: >256 Microsteps
Voltage - Supply: 4.75V to 5.25V
Operating Temperature Range: -20°C to 85°C
Mounting Type: Surface Mount
Package: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: EMP20-E2
Quality and Safety Features
Robust operating temperature range ensuring stability across various environments
Compatibility
The device is a general-purpose motor controller capable of driving bipolar stepper motors.
Application Areas
Can be employed in diverse general-purpose applications requiring stepper motor control.
Product Lifecycle
The NJU39612E2 has been marked as Obsolete, indicating it is no longer in active production. Users should consult the manufacturer regarding replacements or upgrades.
Several Key Reasons to Choose This Product
Provides precise control of stepper motors with microstepping capability
Suitable for tight power management requirements with a specific supply voltage range
Supports a wide range of operating temperatures for versatility in application environments
Accurate and reliable motor direction management and commutation
Ease of integration into systems due to surface mount packaging