Manufacturer Part Number
EPM7032SLC44-7N
Manufacturer
Intel
Introduction
Intel's EPM7032SLC44-7N is a high-density, programmable logic device with a wide range of applications. Part of the MAX® 7000S series, it offers flexible in-system programmability with user-friendly software support.
Product Features and Performance
In-system programmable CPLD
Contains 32 macrocells and 2 logic elements/blocks
Features 600 gates for logic function implementation
36 programmable I/O pins
Maximum propagation delay time of 7.5 ns
Supports internal voltage supply ranging from 4.75V to 5.25V
Product Advantages
Simplified logic design and board layout with CPLD integration
Easy implementation of custom logic functions
In-system programmability facilitates iterative design and updates
Reduced time-to-market thanks to quick logic development
Reliable performance by a reputable manufacturer
Key Technical Parameters
Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5 ns
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 32
Number of Gates: 600
Number of I/O: 36
Quality and Safety Features
Strict manufacturing control for high product quality
Thermal protection within operating temperature range of 0°C ~ 70°C
Compatibility
Compatible with surface mount technology
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)
Application Areas
Ideal for use in telecommunications, computing, automotive, industrial controls, and consumer electronics
Product Lifecycle
Obsolete status
Potential need to seek replacements or consider next-generation alternatives for new designs
Several Key Reasons to Choose This Product
High integration of logic elements enables complex designs while saving space
Proven track record for reliable and durable performance in various applications
Intel's continued software support despite the product being in the obsolete category
In-system programmability allows for design flexibility and easy updates
Broad compatibility with common assembly processes due to standard package формат