Manufacturer Part Number
EPM570F256C3N
Manufacturer
Intel
Introduction
The EPM570F256C3N is part of Intel’s MAX® II series of Embedded CPLDs (Complex Programmable Logic Devices), designed for high-performance, low-power applications.
Product Features and Performance
In System Programmable
Delay Time tpd(1) Max of 5.4 ns
Voltage Supply - Internal: 2.5V or 3.3V
Number of Logic Elements/Blocks: 570
Number of Macrocells: 440
Number of I/O: 160
Supports surface mounting technology
Product Advantages
High integration capability with 570 logic elements and 440 macrocells
Flexible I/O handling with 160 input/output pins
Optimized for low power consumption
Robust performance with a maximum delay time of 5.4 ns
Key Technical Parameters
Voltage Supply - Internal: 2.5V, 3.3V
Number of Logic Elements/Blocks: 570
Number of Macrocells: 440
Number of I/O: 160
Delay Time tpd(1) Max: 5.4 ns
Quality and Safety Features
Operates reliably within the temperature range of 0°C ~ 85°C (TJ)
Compatibility
Compatible with surface mount technology
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)
Application Areas
Ideal for use in automotive, data processing, high-end communication systems, industrial applications, and consumer electronics due to its versatility and performance.
Product Lifecycle
Status: Active
As a currently active product, it includes ongoing manufacturer support and availability; there was no indication of nearing discontinuation, and replacements or upgrades should remain available.
Several Key Reasons to Choose This Product
Flexible and sufficient I/O pin count and configuration paired with high functionality for complex designs.
High-speed performance with a maximum delay time of 5.4 ns ensuring efficient processing.
Provides stable operation with a wide temperature range from 0°C to 85°C.
Supports multiple internal voltage supplies, promising adaptability to various board configurations and needs.
Reliable surface mount compatibility ensures a secure and lasting fit in various applications.