Manufacturer Part Number
EPM1270F256C5N
Manufacturer
Intel
Introduction
The EPM1270F256C5N is a high-performance, in-system programmable complex programmable logic device (CPLD) from Intel’s MAX® II series. It is designed for low-cost, low-power applications and offers advanced features for easy programmability and quick deployment.
Product Features and Performance
In System Programmable
Supports advanced 2.5V and 3.3V internal voltage supply
Features 1270 logic elements/blocks and 980 macrocells
Contains 212 I/O pins
Fast performance with a maximum delay time (tpd) of 6.2 ns
Operating temperature range from 0°C to 85°C (TJ)
Surface mount, 256-BGA package
Sustainable for high-density logic designs
Product Advantages
Low power consumption, enhancing energy efficiency
High integration capability due to a large number of macrocells and I/O pins
Thermal management facilitated by TJ operating temperature range
Extensive compatibility with various standard voltage levels and temperature conditions
Key Technical Parameters
Delay Time tpd(1) Max: 6.2 ns
Voltage Supply Internal: 2.5V, 3.3V
Number of Logic Elements/Blocks: 1270
Number of Macrocells: 980
Number of I/O: 212
Operating Temperature: 0°C ~ 85°C (TJ)
Package: 256-BGA
Quality and Safety Features
Designed for reliable performance in diverse environments
Built adhering to stringent industry standards for safety and quality
Compatibility
Compatible with various surface mount technologies due to the packaging format
Interoperable within diverse system voltage settings and thermal conditions
Application Areas
Automotive
Telecommunications
Consumer Electronics
Industrial automation
Product Lifecycle
Status: Active
Currently not nearing discontinuation
Regular updates and support available
Potential future replacements or upgrades are in development
Several Key Reasons to Choose This Product
Manufactured by Intel, known for innovative and reliable technology solutions
Low power consumption and high performance suited for power-sensitive applications
Comprehensive support and service through the product lifecycle
Enhanced thermal performance suitable for rigorous work environments
Extensive I/O capabilities supporting a variety of design needs and complexities