Manufacturer Part Number
EPF8452ATC100-3
Manufacturer
Intel
Introduction
Intel's EPF8452ATC100-3 is part of their FLEX 8000 series of embedded FPGAs, designed for a wide range of electronic applications.
Product Features and Performance
Programmable logic device with field programmable gate array architecture
Offers 42 Logic Array Blocks/LABs for flexible logic implementation
Provides a total of 336 logic elements/cells
Supports 78 user I/O pins for interfacing
Can implement up to 4000 logic gates for complex logic functions
Operates within the supply voltage range of 4.75V to 5.25V
Designed for surface mount technology with a 100-TQFP footprint
Functional within the industry-standard temperature range from 0°C to 70°C
Product Advantages
Ability to reprogram in the field for application-specific functionality
Adequate logic resources for medium complexity designs
Large number of I/Os available for peripherals and interface requirements
Flexibility in programming with support for various logic designs
Compatible with a standard range of power supplies
Key Technical Parameters
Number of LABs/CLBs: 42
Number of Logic Elements/Cells: 336
Number of I/O: 78
Number of Gates: 4000
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)
Quality and Safety Features
Designed to adhere to industry standards for quality and reliability
Robust performance across the specified operating temperature range
Compatibility
Compatible with surface mount technology (SMT) for easy PCB assembly
Supports standard programming interfaces and tools for FPGAs
Application Areas
Ideal for use in communications, automotive, industrial control systems, consumer electronics, and other embedded applications
Product Lifecycle
Status: Obsolete
Information on replacement or upgrades may be sought from Intel for newer FPGA solutions
Several Key Reasons to Choose This Product
Manufactured by Intel, a renowned semiconductor and FPGA producer
The reprogrammable nature allows for extensive project longevity and adaptability
Sufficient logic resources and I/Os for a variety of medium complexity applications
Surface mount package aids in streamlined PCB design
Backed by Intel's support and reliability standards