Manufacturer Part Number
EPF6024AFC256-3
Manufacturer
Intel
Introduction
The EPF6024AFC256-3 is part of Intel's FLEX 6000 series of embedded Field Programmable Gate Arrays (FPGAs) designed for high-performance applications requiring a significant amount of logic processing and flexible I/O configurations.
Product Features and Performance
Contains 196 LABs/CLBs and 1960 Logic Elements/Cells
Features a total of 219 I/O ports
Includes 24000 gates for complex circuitry
Operates on a supply voltage of 3V to 3.6V
Surface mount, 256-BGA packaging for robust integration
Functions optimally within a temperature range of 0°C to 85°C
Product Advantages
High density of logic elements enables versatile and complex digital circuit design
Ample I/O ports facilitate extensive interfacing with other system components
BGA packaging ensures reduced footprint and enhanced reliability
Key Technical Parameters
Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 1960
Number of I/O: 219
Voltage Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C
Quality and Safety Features
Built using reliable BGA technology to ensure stable connections and longevity
Tested extensively for operation under specified temperature ranges
Compliant with industry standards for electronic component safety and performance
Compatibility
Designed for use in systems requiring high-speed logic operations and flexible configuration
Compatible with other devices and components operating at similar voltage and temperature specifications
Application Areas
Telecommunications
Automotive electronics
Industrial automation
Consumer electronics
Product Lifecycle
Classified as Obsolete
For current systems, check for compatibility and availability of replacements or upgrades
Several Key Reasons to Choose This Product
Intel's robust technology and support in FPGA solutions
High integration capability with 1960 logic cells and 219 I/Os facilitating comprehensive system designs
Appropriate for various demanding applications across multiple industries
Reliable performance ensured by stringent quality measures and package type