EPF10K50RC240-3 - Intel

Manufacturer Part Number

EPF10K50RC240-3

Manufacturer

Intel

Introduction

The EPF10K50RC240-3 is an FPGA from Intel's FLEX-10K® series designed for complex digital logic applications, providing a flexible, programmable architecture.

Product Features and Performance

Embedded FPGA (Field Programmable Gate Array) technology

Offers 360 Logic Array Blocks (LABs)

Includes 2880 Logic Elements/Cells

Provides a total of 20480 RAM bits for data storage

Features 189 available Input/Output pins

Supports a gate count of 116000 for robust digital processing

Operates efficiently with a supply voltage range of 4.75V to 5.25V

Product Advantages

High logic density ensures suitability for complex designs

Wide I/O options for versatile connectivity

Extended on-chip memory enhances deep data handling

Designed for optimal performance in standard operating conditions 0°C to 70°C

Key Technical Parameters

Number of Logic Blocks: 360

Logic Elements/Cells: 2880

RAM Bits: 20480

I/O Pins: 189

Gate Count: 116000

Voltage Supply: 4.75V ~ 5.25V

Operating Temperature Range: 0°C ~ 70°C

Quality and Safety Features

Manufactured adhering to stringent quality controls

Tested for performance stability in specified temperature and voltage conditions

Compatibility

Compatible with surface mount technology for ease of board integration

Fits a 240-BFQFP Exposed Pad package, making it suitable for compact designs

Application Areas

Ideal for telecommunications, computing, automotive electronics, and industrial control systems

Product Lifecycle

Tagged as Obsolete indicating discontinuation

Replacement options or upgrades should be consulted with Intel for newer FPGA models

Several Key Reasons to Choose This Product

Obsolete status offers potential cost benefits for specific legacy system repairs

High gate count and extensive I/O facilitate complex digital system integrations

Broad operating temperature range makes it suitable for various environmental conditions

Surface mounting compatibility simplifies assembly processes on electronic boards