EPF10K30BC356-4 - Intel

Manufacturer Part Number

EPF10K30BC356-4

Manufacturer

Intel

Introduction

Integrated Circuit (IC) chip

Embedded FPGA (Field Programmable Gate Array)

Product Features and Performance

1728 Logic Elements/Cells

12288 Total RAM Bits

216 Number of LABs/CLBs

69000 Number of Gates

Operating temperature: 0°C to 70°C

Product Advantages

Flexible and reconfigurable design

High logic density

Embedded memory

Suitable for a wide range of applications

Key Technical Parameters

Package: 356-BGA (35x35)

Mounting Type: Surface Mount

Supply Voltage: 4.75V to 5.25V

Number of I/O: 246

Quality and Safety Features

Stringent quality control and testing

Compliance with industry standards

Compatibility

Compatible with various FPGA development tools and ecosystem

Application Areas

Embedded systems

Industrial automation

Communication systems

Signal processing

Image processing

Product Lifecycle

Currently in production

Replacement or upgrade options may be available in the future

Key Reasons to Choose This Product

High logic capacity and embedded memory

Flexible and reconfigurable design

Wide operating temperature range

Proven reliability and quality

Compatibility with industry-standard tools and ecosystems