Manufacturer Part Number
EPF10K200SBC600-2
Manufacturer
Intel
Introduction
Integrated Circuit (IC) device
Embedded Field Programmable Gate Array (FPGA)
Product Features and Performance
9,984 Logic Elements/Cells
98,304 Total RAM Bits
1,248 Number of LABs/CLBs
513,000 Number of Gates
470 Number of I/Os
Operating Temperature: 0°C to 70°C
Product Advantages
Reconfigurable and reprogrammable design
Flexible and customizable functionality
High performance and integration
Key Technical Parameters
Package: 600-BGA (45x45)
Mounting Type: Surface Mount
Supply Voltage: 2.375V to 2.625V
Series: FLEX-10KS
Quality and Safety Features
Rigorous quality control and testing
Compliant with industry standards
Compatibility
Designed for embedded systems and applications
Application Areas
Suitable for a wide range of embedded applications
Ideal for custom hardware designs and prototyping
Product Lifecycle
Current product offering
Availability of replacement or upgraded models
Key Reasons to Choose This Product
High logic density and integration
Flexible and reconfigurable design
Reliable performance and quality
Suitable for diverse embedded applications