EPF10K10ATC100-3N - Intel

Manufacturer Part Number

EPF10K10ATC100-3N

Manufacturer

Intel

Introduction

Intel's EPF10K10ATC100-3N is an embedded FPGA from the FLEX-10KA® series designed for programmable logic solutions.

Product Features and Performance

Embedded FPGA (Field Programmable Gate Array) from the FLEX-10KA® series

Provides a large array of programmable logic cells and interconnects

72 LABs/CLBs for logic processing

576 logic elements/cells for intricate designs

Integrates 6144 total RAM bits for data storage

66 I/O pins for versatile connection options

31000 gates for complex logic implementation

Surface Mount Technology (SMT) for robust and compact PCB layouts

Product Advantages

Manufactured by a leading semiconductor company, Intel

Designed to support a range of configurable logic applications

High flexibility in design with its programmable nature

Key Technical Parameters

Number of LABs/CLBs: 72

Number of Logic Elements/Cells: 576

Total RAM Bits: 6144

Number of I/O: 66

Number of Gates: 31000

Voltage Supply: 3V ~ 3.6V

Operating Temperature: 0°C ~ 70°C (TA)

Mounting Type: Surface Mount

Package / Case: 100-TQFP

Supplier Device Package: 100-TQFP (14x14)

Quality and Safety Features

Operating Temperature Range of 0°C ~ 70°C ensures reliability

Compatibility

Standard 3V ~ 3.6V power supply compatibility

100-TQFP packaging compatible with common surface mount processes

Application Areas

Ideal for customized digital logic circuits in embedded systems

Suitable for applications requiring hardware programmability and high integration

Product Lifecycle

Obsolete Product Status indicates that this model is not recommended for new designs

Potential for replacement or upgrades, buyers should look for newer FPGA generations or equivalents

Several Key Reasons to Choose This Product

High gate count enabling complex digital systems

Flexibility and reusability supporting iterative design and prototyping

Quality guaranteed by Intel's reputation in the semiconductor industry

Surface mount package compatible with modern PCB assembly processes

Adequate for a wide range of temperature-sensitive applications due to thermal performance