EPF10K100ARC240-1N - Intel

Manufacturer Part Number

EPF10K100ARC240-1N

Manufacturer

Intel

Introduction

The EPF10K100ARC240-1N is part of Intel's FLEX-10KA® series, which are embedded FPGAs (Field Programmable Gate Arrays) designed for advanced digital circuit development and applications.

Product Features and Performance

Embedded FPGA with 158,000 gate density

Comprised of 624 Logic Array Blocks (LABs) and 4992 logic elements/cells

Features 24,576 total RAM bits allowing for efficient data handling

Provides 189 I/O pins for extensive connectivity

Supports voltage supply from 3V to 3.6V

Designed with 240-BFQFP Exposed Pad for surface mount

Operates within temperature range of 0°C to 70°C

Product Advantages

High logic capacity and gate density for complex designs

Versatile I/O count facilitating wide range usage

Compact and robust physical packaging suitable for dense board layouts

Key Technical Parameters

Logic Elements: 4992

Gates: 158,000

RAM Bits: 24,576

Input/Output Ports: 189

Voltage Supply: 3V ~ 3.6V

Operating Temperature: 0°C ~ 70°C

Quality and Safety Features

Compliant with standard industry protocols for safety and performance

Built to tolerate specific operating temperature and power supply constraints ensuring reliability

Compatibility

Compatible with typical FPGA design tools and software

Suitable for integration in varied electronic environments due to standard voltage and temperature ranges

Application Areas

Telecommunications

High-speed computing applications

Embedded system design

Consumer electronics

Industrial automation

Product Lifecycle

Status: Obsolete

Note: Replacement or upgraded models may be available. Check with Intel for latest models or substitute products.

Several Key Reasons to Choose This Product

High-density and robust design suitable for advanced computing and signal processing tasks

Flexible I/O configuration supports broad implementation options

Reliable operation within a broad industrial temperature range

Surface mount package allows for efficient use of PCB space