Manufacturer Part Number
EPF10K100ABC356-1
Manufacturer
Intel
Introduction
High-performance, high-density field-programmable gate array (FPGA)
Suitable for embedded applications
Product Features and Performance
4,992 logic elements
24,576 total RAM bits
624 logic array blocks (LABs)
158,000 gates
274 I/O pins
3V to 3.6V operating voltage
Product Advantages
Flexible and reconfigurable design
High logic density
Embedded memory for data storage and processing
Wide range of I/O options
Key Technical Parameters
Package: 356-BGA (35x35)
Mounting Type: Surface Mount
Operating Temperature: 0°C to 70°C
Quality and Safety Features
Manufactured by Intel, a leading semiconductor company
Meets industrial quality and reliability standards
Compatibility
Suitable for a wide range of embedded systems and applications
Application Areas
Industrial automation
Telecommunications equipment
Medical devices
Automotive electronics
Product Lifecycle
This product is currently in production and available for purchase
Replacement or upgrade options may be available from Intel in the future
Key Reasons to Choose This Product
High-performance FPGA with a large number of logic elements and embedded memory
Flexible and reconfigurable design for custom applications
Wide range of I/O options for interfacing with various systems
Proven reliability and quality from a leading semiconductor manufacturer
Compatibility with a wide range of embedded applications