EP4SGX530HH35I3N - Intel

Manufacturer Part Number

EP4SGX530HH35I3N

Manufacturer

Intel

Introduction

High-performance embedded FPGA for demanding applications

Product Features and Performance

Advanced 40 nm process technology

High-density integration with 531,200 logic elements

Large memory capacity with 28,033,024 total RAM bits

Supports 564 I/O pins for versatile connectivity

Operates at a core voltage of 0.87V to 0.93V

Suitable for surface mount technology

Product Advantages

Offers a balance of performance, power efficiency and programmability

Supports high-speed transceiver I/Os for enhanced data processing

Capable of handling complex digital signal processing applications

Key Technical Parameters

Number of LABs/CLBs: 21,248

Number of Logic Elements/Cells: 531,200

Total RAM Bits: 28,033,024

Number of I/O: 564

Voltage Supply: 0.87V ~ 0.93V

Operating Temperature: -40°C ~ 100°C (TJ)

Quality and Safety Features

Adheres to stringent Intel quality and reliability standards

Extended operating temperature range ensures performance in harsh environments

Compatibility

Compatible with common FPGA development tools and software

Can be integrated into various system architectures due to flexible I/O options

Application Areas

High-performance computing

Networking

Communications infrastructure

Military and aerospace electronics

Industrial automation

Product Lifecycle

Obsolete status, check for replacement or upgrade options available from Intel

Several Key Reasons to Choose This Product

Manufactured by Intel, a leader in semiconductor technology

Capable of supporting high-speed and high-density requirements

Energy-efficient operation with low core voltage supply

Suitable for a variety of complex applications

Long-term reliability and operation in wide temperature ranges