EP4SGX360HF35C3N - Intel

Manufacturer Part Number

EP4SGX360HF35C3N

Manufacturer

Intel

Introduction

High-performance FPGA designed for embedded systems

Product Features and Performance

14144 logic array blocks (LABs)

353600 logic elements/elements (LEs)

23105536 total RAM bits

564 I/O pins

Stratix® IV GX series for high-speed applications

Product Advantages

Advanced logic fabric for increased performance

High-density integration for space-constrained applications

Integrated transceivers for high-speed communication

Key Technical Parameters

Voltage supply range: 0.87V ~ 0.93V

Operating temperature range: 0°C ~ 85°C

1152 balls Fine-Pitch Ball Grid Array (FBGA) packaging

Quality and Safety Features

Tested for operation within industrial temperature ranges

Robust surface-mount packaging for reliable solder connections

Compatibility

Compatible with various design software tools for FPGA development

Supports standard communication protocols through high-speed transceivers

Application Areas

High-speed computing

Network infrastructure

Telecommunications equipment

Defense and aerospace systems

Product Lifecycle

Obsolete status, indicating potential challenges in sourcing and availability

Considerations for alternative solutions may be necessary

Several Key Reasons to Choose This Product

Provides a balance between high performance and power efficiency

Suited for advanced systems requiring significant logic and I/O resources

Support from an established global semiconductor company (Intel)

Good fit for high-bandwidth and high-density applications in need of an FPGA