Manufacturer Part Number
EP4SGX180HF35I3N
Manufacturer
Intel
Introduction
High-density, high-performance embedded FPGA
Product Features and Performance
Utilizes Stratix IV GX series architecture
Advanced multi-gigabit transceivers for high-speed communication
Adaptive logic modules (ALMs) for increased logic density
DSP blocks for high-performance signal processing
Product Advantages
Integration of a large number of logic elements and RAM for complex designs
High I/O count for extensive interfacing capabilities
Low voltage operation for power efficiency
Key Technical Parameters
LABs/CLBs: 7030
Logic Elements/Cells: 175750
Total RAM Bits: 13954048
Number of I/O: 564
Supply Voltage: 0.87V ~ 0.93V
Operating Temperature Range: -40°C ~ 100°C (TJ)
Quality and Safety Features
Robust surface mount package: 1152-BBGA, FCBGA
Wide operating temperature range ensures reliability in harsh conditions
Compatibility
Surface Mount for integration on various PCBs
Compatible with high-density board designs
Application Areas
High-speed computing
Digital signal processing
Network infrastructure
Telecommunications
Product Lifecycle
Obsolete status
Replacements or upgrades should be considered for new designs
Key Reasons to Choose This Product
Suitable for high-complexity and high-speed applications
Extensive logic resources for design flexibility
High integration reduces board space requirements
Support for a wide variety of interface standards
Proven reliability from Intel as Manufacturer
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