Manufacturer Part Number
EP4SE230F29I3N
Manufacturer
Intel
Introduction
High-density, high-performance Embedded FPGA
Product Features and Performance
228,000 Logic Elements
17,544,192 Total RAM Bits
Surface Mount Technology
-40°C to 100°C Operating Temperature Range
Advanced networking capabilities
Enhanced memory support
Product Advantages
High logic element count benefits complex designs
Large memory capacity for data-intensive applications
Robust temperature range ensures reliability across environments
Key Technical Parameters
9120 LABs/CLBs
228,000 Logic Elements/Cells
17,544,192 Total RAM Bits
488 Number of I/O
87V to 0.93V Supply Voltage
780-BBGA, FCBGA Package
Quality and Safety Features
Complies with industry quality and safety standards
Compatibility
Supports various design requirements due to high I/O count
Application Areas
Advanced digital signal processing
High-speed communications
Industrial automation
Medical devices
Product Lifecycle
Obsolete
Potential for replacement or upgrade options available
Several Key Reasons to Choose This Product
Offers a substantial amount of logic resources for complex designs
Affords a significant amount of RAM for supporting high-bandwidth applications
Proven reliability in extreme temperature conditions
The versatility provided by the number of IOs
Backed by Intel, a leader in the semiconductor industry
EP4SE230F29C3ALTERA
EP4SE360F35I3G
EP4SE230F35I4NADIntelIC FPGA 1152FBGA