Manufacturer Part Number
EP4CGX75CF23C8N
Manufacturer
Intel
Introduction
Intel's EP4CGX75CF23C8N is part of the Cyclone® IV GX series, a highly efficient and versatile family of Embedded Field Programmable Gate Arrays designed for a wide range of applications.
Product Features and Performance
Utilizes 46,320 Logic Elements/Cells for flexible and customizable logic implementation.
Features 4,257,792 Total RAM Bits for high-capacity data storage.
Supports up to 290 I/O pins for extensive peripheral connectivity.
Operates at a supply voltage of 1.16V to 1.24V for low power consumption.
Embedded Transceivers for high-speed data communication.
Supports vertical migration for design scalability.
Product Advantages
Offers a balance of cost, power, and performance for budget-sensitive projects.
Enables rapid prototyping and development due to its reprogrammable nature.
High density and functionality support complex logic applications.
Key Technical Parameters
Number of LABs/CLBs: 4620
Logic Elements/Cells: 73920
Total RAM Bits: 4257792
Number of I/O: 290
Voltage Supply: 1.16V ~ 1.24V
Operating Temperature: 0°C ~ 85°C
Quality and Safety Features
Undergoes rigorous testing for quality assurance.
Features built-in security protocols to protect intellectual property.
Compatibility
Compatible with Intel's development and programming tools.
Supports various IO standards for interoperability with a wide range of peripherals.
Application Areas
Ideal for automotive, industrial, communication, and military uses.
Suitable for high-speed data processing, signal processing, and control applications.
Product Lifecycle
Currently marked as Active, not nearing discontinuation.
Intel provides continuous support with potential for future upgrades.
Several Key Reasons to Choose This Product
Intel's reputation for reliability and performance in FPGA technology.
A well-balanced choice for projects requiring a mix of performance, power efficiency, and cost-effectiveness.
Extensive support and documentation available, facilitating ease of development.
Scalable and flexible design options with vertical migration capability.
Broad application compatibility from telecommunications to consumer electronics.