Manufacturer Part Number
EP3SL70F780I3N
Manufacturer
Intel
Introduction
Intel's EP3SL70F780I3N is an FPGA from the Stratix® III L series designed for high-end applications requiring a configurable logic solution.
Product Features and Performance
Comprises 2700 Logic Array Blocks (LABs)
Features 67500 Logic Elements/Cells
Offers 2699264 Total RAM Bits
Provides 488 I/O pins for versatile connectivity
Supports voltage supply between 0.86V and 1.15V
Surface Mount technology for PCB integration
Operates within a temperature range of -40°C to 100°C
Enclosed in a 780-BBGA, FCBGA package
Utilizes Intel's 780-FBGA (29x29) device package
Product Advantages
High logic density with ample I/O options for complex designs
Sufficient on-chip memory for demanding applications
Broad voltage supply range enabling energy-efficient operation
Suitable for harsh environments due to its operational temperature range
High integration capability because of surface mount design
Key Technical Parameters
Number of LABs/CLBs: 2700
Logic Elements/Cells: 67500
Total RAM Bits: 2699264
Number of I/O: 488
Voltage Supply Range: 0.86V ~ 1.15V
Operating Temperature: -40°C ~ 100°C
Package Type: 780-BBGA, FCBGA
Quality and Safety Features
Robust thermal performance up to 100°C
Compliant with industry-standard safety and quality norms
Compatibility
Compatible with a range of surface mount technologies and standard PCB design practices
Application Areas
Ideal for complex digital signal processing
Suitable for telecommunications infrastructure
Applicable in industrial automation systems
Deployable in aerospace and defense electronics
Product Lifecycle
Product Status: Obsolete
Consider alternatives or last-time buys
Potential for manufacturer support limitations
Upgrades or replacements should be explored
Several Key Reasons to Choose This Product
Advanced logic cell and LAB count for extensive programmability
Large capacity of integrated RAM for high-performance tasks
Robust I/O pin count for comprehensive external interfacing
Flexible voltage operation for power-sensitive applications
Durable for extreme temperature operations
Integration-friendly package for streamlined manufacturing processes