Manufacturer Part Number
EP3SE80F780I3N
Manufacturer
Intel
Introduction
Intel Stratix III FPGA designed for high-performance, high-density, and low-power applications
Product Features and Performance
Advanced high-performance, multi-gigabit transceivers
Integrated memory controllers
Enhancements in core architecture for increased efficiency
DSP blocks optimized for high-performance filtering and signal processing
Adaptive logic modules (ALMs) optimized for combination and sequential logic
Product Advantages
High logic element density for complex logic design
Lower power consumption with Programmable Power Technology
Robust system bandwidth with high-speed transceivers and memory interfaces
Key Technical Parameters
Number of LABs/CLBs: 3200
Number of Logic Elements/Cells: 80000
Total RAM Bits: 6843392
Number of I/O: 488
Voltage Supply: 0.86V to 1.15V
Mounting Type: Surface Mount
Operating Temperature: -40°C to 100°C (TJ)
Package/Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)
Quality and Safety Features
Compliance with various industry standards for compatibility and safety
Designed for reliability in various temperature environments
Compatibility
Compatible with a broad range of industry-standard interfacing requirements
Versatile I/O counts for integration into various system-level designs
Application Areas
High-speed computing
High-density digital signal processing
Network infrastructure
Advanced system integration
Product Lifecycle
Obsolete status
Potential availability of replacements or upgrades within Intel FPGA product families
Several Key Reasons to Choose This Product
Ideal for challenging applications requiring a combination of high-speed logic, ample on-chip memory, and high I/O counts
Power scalability and efficiency suited to green or low-power technology requirements
Supported by Intel's extensive FPGA design ecosystem including software tools, IP, and reference designs
Capable of handling advanced digital signal processing and data manipulation
Ideal for integration into a wide range of high-end applications due to its robust temperature range and quality features
