EP3SE110F780I3N - Intel

Manufacturer Part Number

EP3SE110F780I3N

Manufacturer

Intel

Introduction

Intel Stratix III E family FPGA designed for high-performance, high-density, and low-power applications.

Product Features and Performance

Advanced 65nm process technology

Built on the Stratix III E family platform

High-density with 107,500 logic elements

Rich in embedded memory with 8,936,448 total RAM bits

Supports a large number of I/O pins: 488

Flexible power supply voltage from 0.86V to 1.15V

Can be surface-mounted and hosts 780 pins

Adaptable I/O standards and protocols

Product Advantages

Energy-efficient design reduces power consumption

Large available logic and memory for complex designs

Flexible I/O count for diverse application scenarios

Excellent signal integrity for high-speed applications

Key Technical Parameters

Number of LABs/CLBs: 4300

Number of Logic Elements/Cells: 107500

Total RAM Bits: 8936448

Number of I/O: 488

Voltage Supply: 0.86V ~ 1.15V

Mounting Type: Surface Mount

Operating Temperature: -40°C ~ 100°C (TJ)

Package / Case: 780-BBGA, FCBGA

Supplier Device Package: 780-FBGA (29x29)

Base Product Number: EP3SE110

Quality and Safety Features

Strict adherence to Intel's quality standards

Long operational temperature range ensures stability under varying conditions

Compatibility

Compatibility with a wide array of industry-standard peripherals and interfaces

Application Areas

High-performance computing

Networking and telecommunications

Industrial, military, and aerospace applications

Product Lifecycle

Obsolete status indicates no longer in production

Potential for replacement or upgrade solutions

Several Key Reasons to Choose This Product

High system integration facilitates smaller form factors

Robust thermal performance for reliability in extended temperature ranges

Adequate for handling complex algorithms and data-intensive processes

Backed by Intel's industry-leading technology and support systems