Manufacturer Part Number
EP3SE110F1152C2N
Manufacturer
Intel
Introduction
High-performance, high-density programmable logic device
Product Features and Performance
4300 Logic Array Blocks (LABs)
107500 Logic Elements/Cells
8936448 Total RAM Bits
744 Number of I/O pins
Supports 0.86V ~ 1.15V Supply Voltage
Surface Mount Technology
Operates at 0°C ~ 85°C Temperature Range
1152-BBGA, FCBGA Package
Stratix® III E Series FPGA
Product Advantages
High logic density for complex designs
Abundant memory resources
Large number of I/Os for versatile connectivity
Fine-grained power supply support for energy efficiency
Robust thermal performance for reliability
Key Technical Parameters
Number of LABs/CLBs: 4300
Number of Logic Elements/Cells: 107500
Total RAM Bits: 8936448
Number of I/O: 744
Voltage - Supply: 0.86V ~ 1.15V
Operating Temperature: 0°C ~ 85°C
Quality and Safety Features
Lead-Free and RoHS Compliant
Extended temperature range support for industrial applications
Compatibility
Standard 1152-FBGA (35x35) package for PCB integration
Compatible with a wide range of voltage levels and I/O standards
Application Areas
Telecommunications
Networking Infrastructure
High-end computing systems
Industrial applications
Medical electronics
Product Lifecycle
Obsolete status
Potential need for replacement or upgrade evaluation
Several Key Reasons to Choose This Product
High integration capacity suitable for complex digital systems
A substantial number of I/Os enabling versatile peripheral connections
Ample internal memory, facilitating sophisticated on-chip data management
Optimized for low-power consumption, suitable for power-sensitive applications
Intel's reputation for reliability and long-term performance
Surface Mount package compatible with modern PCB assembly processes
Support for a broad operating temperature suitable for industrial applications
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EP3SE110F1152I2N