EP3C80F484I7 - Intel

Manufacturer Part Number

EP3C80F484I7

Manufacturer

Intel

Introduction

High-performance, low-power Cyclone III FPGA suitable for a wide array of applications

Product Features and Performance

50,479 Logic Array Blocks (LABs)

81,264 Logic Elements/Cells

2,810,880 Total RAM bits

295 I/O pins

Core voltage supply of 1.15V to 1.25V

Surface mount 484-BGA package

Extended operating temperature range from -40°C to 100°C

Based on 65 nm process technology

Product Advantages

High logic density for complex designs

Low power consumption for energy efficiency

Abundant memory and I/O resources

Robust temperature range for harsh environments

Key Technical Parameters

Number of LABs/CLBs: 5079

Number of Logic Elements/Cells: 81264

Total RAM Bits: 2810880

Number of I/O: 295

Voltage Supply: 1.15V ~ 1.25V

Operating Temperature: -40°C ~ 100°C (TJ)

Mounting Type: Surface Mount

Package/Case: 484-BGA

Supplier Device Package: 484-FBGA (23x23)

Quality and Safety Features

Lead-free and RoHS compliant

High reliability and longevity

Compatibility

Compatible with standard surface mount technology and Cyclone III device family tools and software

Application Areas

Industrial control systems

Automotive electronics

Telecommunication infrastructure

Consumer electronics

Aerospace and defense applications

Product Lifecycle

Active product status with no current plan for discontinuation

Support and resources readily available

Several Key Reasons to Choose This Product

Proven track record of Intel's robust FPGA technology

Cost-effective for volume production with tray packaging

Ideal for energy-sensitive applications due to low power design

Easy integration with a wide range of existing designs and applications

Comprehensive technical support and documentation from Intel

Flexibility to adapt to changing design needs with programmable logic

Long-term availability ensures product longevity and future-proofing designs