Manufacturer Part Number
EP3C25F256A7N
Manufacturer
Intel
Introduction
The EP3C25F256A7N is part of Intel’s Cyclone® III FPGA series, designed for embedded applications that require high performance and low power consumption.
Product Features and Performance
FPGA Field Programmable Gate Array
Utilizes 24,624 logic elements/cells
Contains 1,539 Logic Array Blocks (LABs)/CLBs
Provides 608,256 total RAM bits
Supports 156 I/O pins
Operating temperature ranges from -40°C to 125°C
Product Advantages
Low power consumption
High integration to reduce system costs
Extended temperature range suits harsh environments
Key Technical Parameters
Voltage Supply: 1.15V to 1.25V
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)
Quality and Safety Features
Robust surface mount package
Rigorous quality control by Intel ensures high reliability
Compatibility
Compatible with a wide range of standard design and development tools in the industry
Application Areas
Telecommunications
Consumer Electronics
Automotive Systems
Industrial Controls
Product Lifecycle
Product status: Active
Not near discontinuation, with ongoing support and availability
Several Key Reasons to Choose This Product
Highly flexible and configurable to match specific application needs
Supported by Intel’s comprehensive software tools for easier integration
Durable design allows operation in extreme conditions
Advanced performance at competitive pricing