Manufacturer Part Number
EP2SGX30CF780C3N
Manufacturer
Intel
Introduction
High-performance, low-power FPGA (Field Programmable Gate Array) for embedded applications
Product Features and Performance
33,880 logic elements for advanced processing capabilities
1,369,728 total RAM bits for data storage and processing
1,694 logic array blocks (LABs) for flexible logic implementation
361 I/O pins for extensive connectivity
Product Advantages
Optimized for power-sensitive, high-performance embedded applications
Reconfigurable architecture allows for adaptable, custom hardware solutions
Supports advanced features like high-speed serial transceivers and DSP blocks
Key Technical Parameters
0°C to 85°C operating temperature range
15V to 1.25V supply voltage
780-FBGA (29x29) package
Quality and Safety Features
RoHS compliant design
Manufacturer's 780-FBGA (29x29) packaging for reliability and durability
Compatibility
Compatible with Stratix II GX FPGA family
Application Areas
Embedded systems
Industrial automation and control
Communications and networking equipment
Medical devices
Military and aerospace applications
Product Lifecycle
Current product, no discontinuation plans
Replacement or upgrade options available within the Stratix II GX FPGA family
Reasons to Choose
Powerful processing capabilities for advanced embedded applications
Low power consumption for energy-efficient designs
Flexible, reconfigurable architecture for custom hardware solutions
Extensive connectivity and peripheral support
Reliable, RoHS-compliant design from a trusted manufacturer
EP2SGX130GF1508ALTERA
EP2SGX30CF780I4N