Manufacturer Part Number
EP2S60F484C3N
Manufacturer
Intel
Introduction
High-performance, low-power FPGA (Field Programmable Gate Array) for embedded applications
Product Features and Performance
60,440 Logic Elements
2,544,192 Total RAM Bits
3,022 Number of LABs/CLBs
Supports 1.15V to 1.25V supply voltage
Operating temperature range of 0°C to 85°C
Product Advantages
Flexible and reconfigurable hardware for custom logic design
High logic density and performance for complex embedded systems
Low power consumption suitable for battery-powered or thermal-constrained applications
Key Technical Parameters
484-FBGA (23x23) package
Surface mount package
334 I/O pins
Stratix II FPGA series
Quality and Safety Features
RoHS compliant
Compatibility
Suitable for a wide range of embedded applications
Application Areas
Industrial automation
Medical devices
Telecommunications equipment
Aerospace and defense systems
Product Lifecycle
Current product offering, no discontinuation plans identified
Several Key Reasons to Choose This Product
High logic density and performance for complex embedded designs
Low power consumption for battery-powered or thermal-constrained applications
Flexible and reconfigurable hardware for custom logic implementation
Robust package and operating temperature range for industrial environments
RoHS compliance for environmental and safety considerations
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EP2S30F672I4NAlteraIC FPGA 500 I/O 672FBGA