Manufacturer Part Number
EP2S30F672C3
Manufacturer
Intel
Introduction
High-performance, low-power FPGA solution for embedded applications
Product Features and Performance
33,880 logic elements for advanced functionality
1,369,728 total RAM bits for flexible data storage
1,694 LABs/CLBs for efficient logic implementation
Supports operating temperatures from 0°C to 85°C
Product Advantages
Optimized for low-power, high-performance embedded systems
Flexible and reconfigurable architecture enables custom solutions
Extensive on-chip memory resources for data-intensive applications
Key Technical Parameters
500 I/O pins for extensive connectivity
15V to 1.25V supply voltage range
672-FBGA (27x27) package
Quality and Safety Features
RoHS non-compliant
Compatibility
Compatible with Stratix II FPGA series
Application Areas
Embedded systems
Industrial automation
Telecommunications
Military and aerospace
Product Lifecycle
Current product offering, no discontinuation plans announced
Upgrade options available within Stratix II FPGA series
Key Reasons to Choose This Product
Powerful FPGA with abundant logic and memory resources
Optimized for low-power, high-performance embedded applications
Flexible and reconfigurable architecture for custom solutions
Extensive connectivity options with 500 I/O pins
Wide operating temperature range from 0°C to 85°C
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