EP2AGZ300HF40I4N - Intel

Manufacturer Part Number

EP2AGZ300HF40I4N

Manufacturer

Intel

Introduction

High-performance Embedded FPGA

Product Features and Performance

11920 LABs/CLBs for logic implementation

298000 Logic Elements/Cells

18854912 Total RAM Bits for data storage

734 configurable I/O pins

Supports voltage supply from 0.87V to 0.93V

Surface Mount 1517-BBGA, FCBGA package

Product Advantages

Optimized for high-speed applications

Large number of logic resources and RAM for complex designs

Supports a wide range of I/O standards

Key Technical Parameters

Number of LABs/CLBs: 11920

Logic Elements/Cells: 298000

Total RAM Bits: 18854912

Number of I/O: 734

Voltage - Supply: 0.87V ~ 0.93V

Operating Temperature: -40°C ~ 100°C (TJ)

Package / Case: 1517-BBGA, FCBGA

Supplier Device Package: 1517-FBGA (40x40)

Quality and Safety Features

Reliable performance at industrial temperature ranges

Enhanced safety potential with built-in temperature sensors and voltage monitors

Compatibility

Compatible with various I/O standards for easier integration

Application Areas

Ideal for high-speed communication, industrial, military, and aerospace applications

Product Lifecycle

Obsolete status

Potential for replacements or upgrades limited

Several Key Reasons to Choose This Product

Leading-edge performance for embedded systems

High logic and memory resource counts for advanced processing

Flexible I/O interfacing to meet various design requirements

Robust thermal performance for reliability in harsh environments

Backed by Intel's reputation for quality and long-term support despite obsolescence