Manufacturer Part Number
EP20K400EFC672-2N
Manufacturer
Intel
Introduction
High-performance, high-density FPGA (Field Programmable Gate Array) for embedded applications
Product Features and Performance
16,640 logic elements (LEs)
212,992 total RAM bits
1,664 logic array blocks (LABs)
1,052,000 gates
Support for single-ended and differential I/O standards
Advanced routing resources for high-speed designs
Optimized for low power consumption
Product Advantages
Flexibility and reconfigurability of FPGA technology
High logic density and performance
Suitable for a wide range of embedded applications
Low power operation
Key Technical Parameters
Package: 672-FBGA (27x27)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Supply Voltage: 1.71V ~ 1.89V
Quality and Safety Features
Rigorous quality control and testing processes
Compliance with industry standards and regulations
Compatibility
Compatible with a wide range of FPGA development tools and software
Application Areas
Embedded systems
Industrial automation
Telecommunications
Medical equipment
Military and aerospace applications
Product Lifecycle
This product is currently available and actively supported by Intel
Replacement or upgrade options may be available in the future as technology evolves
Key Reasons to Choose This Product
High logic density and performance for demanding embedded applications
Low power consumption for energy-efficient designs
Flexibility and reconfigurability to adapt to changing requirements
Reliable and well-supported by the Intel ecosystem
Suitable for a wide range of embedded system applications