Manufacturer Part Number
EP20K200EFI484-2X
Manufacturer
Intel
Introduction
The EP20K200EFI484-2X is part of Intel's APEX-20KE® series and is an embedded FPGA designed for high-performance, flexible applications with an extensive array of logic elements and RAM bits.
Product Features and Performance
Contains 832 logic array blocks (LABs) and 8320 logic elements
Equipped with 106,496 total RAM bits
Provides 376 I/O pins
Supports a total gate count of 526,000
Voltage supply ranges from 1.71V to 1.89V
Operational in a temperature range between -40°C and 100°C (TJ)
Surface mount 484-BBGA packaging
Product Advantages
High gate density for complex functionality
Significant number of I/Os for diverse connectivity options
Extensive RAM for increased data handling and storage capacity
Wide temperature range ensures reliability under extreme conditions
Surface mount technology facilitates denser circuit designs
Key Technical Parameters
Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 376
Number of Gates: 526000
Voltage Supply: 1.71V ~ 1.89V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package/Case: 484-BBGA
Quality and Safety Features
Adheres to stringent operating temperature specifications ensuring device durability and performance stability
Compatibility
Compatible with surface mount technology for integration into various PCB designs
Application Areas
Suitable for advanced computing systems, high-speed telecommunications, data processing networks, and industrial automation systems
Product Lifecycle
The product status is obsolete
Users need to consider alternative or upgraded options for future applications
Several Key Reasons to Choose This Product
High logic density and extensive I/O count cater to complex digital designs
Broad operating temperature range makes it suitable for harsh environments
Surface mount package supports compact and efficient hardware layouts
Obsolescence constraints provide opportunities for acquiring the component at potentially reduced costs or considering next-generation upgrades.