EP20K100EBC356-3 - Intel

Manufacturer Part Number

EP20K100EBC356-3

Manufacturer

Intel

Introduction

The EP20K100EBC356-3, part of Intel's APEX-20KE® series, is an embedded FPGA designed for high-performance digital circuitry tasks.

Product Features and Performance

Based on the APEX-20KE® series, optimized for high-speed logic operations.

Contains 416 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs).

Features 4160 logic elements/cells for versatile logic implementation.

Offers a total of 53248 RAM bits for data storage.

Provides 246 I/O pins for extensive external interfacing.

Supports a complex gate structure with 263000 gates.

Operates with a voltage supply range of 1.71V to 1.89V.

Engineered for surface mount technology with a 356-LBGA package.

Product Advantages

High number of I/O and logic elements enhance interfacing and processing capabilities.

Large gate count suitable for complex circuit designs.

Flexible power supply requirements facilitate integration into various system designs.

Surface mount package allows for more compact and efficient PCB layouts.

Key Technical Parameters

Number of LABs/CLBs: 416

Number of Logic Elements/Cells: 4160

Total RAM Bits: 53248

Number of I/O: 246

Number of Gates: 263000

Voltage Supply: 1.71V ~ 1.89V

Operating Temperature: 0°C ~ 85°C

Package / Case: 356-LBGA

Quality and Safety Features

Operates reliably within the 0°C to 85°C temperature range, making it suitable for commercial applications prone to temperature variations.

Compatibility

Designed for surface mount applications, ensuring compatibility with modern PCB manufacturing processes.

Flexible voltage requirements support integration with a range of logic levels and power supplies.

Application Areas

Ideal for complex digital signal processing, telecommunications, computing, and industrial applications requiring versatile, high-speed logic solutions.

Product Lifecycle

Classified as Obsolete, indicating that it is no longer in production. Users should consider potential replacements or upgrades for future designs.

Several Key Reasons to Choose This Product

High logic density and gate count enable complex design implementations within a single chip.

Broad operating temperature range ensures reliability in variable environments.

Surface mount compatibility facilitates easier and more space-efficient PCB designs.

Intel's reputation for producing reliable and high-performing semiconductor products.