Manufacturer Part Number
EP1S30F780C6
Manufacturer
Intel
Introduction
High-performance and high-density FPGA for embedded applications
Product Features and Performance
32,470 logic elements
3,317,184 total RAM bits
3,247 logic array blocks (LABs)
597 user I/O pins
Supports 1.425V to 1.575V supply voltage
Product Advantages
Optimized for embedded systems with low power consumption
Flexible and reconfigurable hardware platform
Supports a wide range of operating temperatures from 0°C to 85°C
Key Technical Parameters
780-FBGA (29x29) package
Surface mount package
RoHS non-compliant
Quality and Safety Features
Rigorous quality control and testing processes
Compatibility
Compatible with Intel's Quartus II design software
Application Areas
Embedded systems
Industrial automation
Communication systems
Medical devices
Product Lifecycle
This product is still in active production and not nearing discontinuation
Replacement or upgrade options may be available from Intel
Key Reasons to Choose This Product
High-performance FPGA with ample logic resources and memory
Optimized for low-power embedded applications
Wide operating temperature range
Flexible and reconfigurable hardware platform
Supported by Intel's design tools and ecosystem
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