Manufacturer Part Number
EP1K50FI256-2N
Manufacturer
Intel
Introduction
The EP1K50FI256-2N is part of Intel's ACEX-1K® series, designed specifically for embedded FPGA applications. It integrates a robust array of features suited for high-performance programmable logic solutions.
Product Features and Performance
Offers a dense matrix of logic cells and configurable logic blocks (360 LABs/CLBs)
Contains 2880 logic elements/cells for complex logic operations
Includes a total of 40960 RAM bits for storage purposes
Provides 186 input/output ports for connectivity
Operates efficiently within a voltage supply range of 2.375V to 2.625V
Built for surface mount technology making it suitable for compact and dense board layouts
Product Advantages
High logic gate count (199,000 gates) facilitates the execution of extensive and intricate logic functions
Wide operating temperature range (-40°C to 85°C) ensures reliable performance under extreme conditions
Key Technical Parameters
Number of LABs/CLBs: 360
Number of Logic Elements/Cells: 2880
Total RAM Bits: 40960
Number of I/O: 186
Number of Gates: 199000
Voltage Supply: 2.375V ~ 2.625V
Operating Temperature: -40°C ~ 85°C
Quality and Safety Features
Built to endure extreme environmental situations, ensuring continuous operation and longevity
Complies with industry standard safety regulations for electronic components
Compatibility
Integrates smoothly with a variety of development environments and existing systems due to its standardized BGA package
Application Areas
Targeted towards the development of embedded systems, IoT devices, and logic-intensive applications
Product Lifecycle
Currently listed as Obsolete, making future procurement for new designs not recommended
Replacement or next-generation models should be considered for newer projects
Several Key Reasons to Choose This Product
High gate count allows accommodation of elaborate and function-rich designs
Supports a broad range of operating temperatures making it ideal for industrial applications
Robust I/O capabilities enhance connectivity options for diverse applications
Compact BGA packaging is beneficial for sleek, modern electronic assemblies
Backed by Intel’s reputation for quality and performance in the semiconductor industry
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