Manufacturer Part Number
EP1K100FC256-3N
Manufacturer
Intel
Introduction
Intel's EP1K100FC256-3N is a high-density programmable logic device featuring advanced integration capabilities designed for a wide range of applications.
Product Features and Performance
624 Logic Array Blocks/LABs
4992 Logic Elements/Cells
49152 Total RAM Bits
186 Input/Output Pins
257000 Gates
Support for various logic functions and complex combinational circuits
Product Advantages
High gate count allows complex designs
Embedded memory enhances data processing
Versatile I/O count for flexible interfacing
Key Technical Parameters
624 LABs/CLBs
4992 Logic Elements/Cells
49152 Total RAM Bits
186 Number of I/O
257000 Number of Gates
375V ~ 2.625V Supply Voltage Range
Surface Mount
0°C ~ 70°C Operating Temperature Range
256-BGA Package
Quality and Safety Features
Compliance with industry standards for quality and reliability
Robust design for stable operation within specified temperature ranges
Compatibility
Fits 256-FBGA (17x17) package footprint
Compatible with various surface mount technologies and PCB designs
Application Areas
Telecommunications
Industrial Control Systems
Automotive Industry
Medical Electronics
Consumer Electronics
Product Lifecycle
Obsolete status
Potential need to evaluate replacement solutions or upgrades due to discontinuation
Several Key Reasons to Choose This Product
Integrated high-density logic for complex circuit implementation
On-chip memory for efficient data manipulation
Flexible I/O capabilities for diverse applications
Intel quality assurance for high-reliability demands
Wide operating temperature range suitable for various environments