Manufacturer Part Number
EP1C6F256C6N
Manufacturer
Intel
Introduction
Intel's EP1C6F256C6N belongs to the Cyclone FPGA series, designed for a wide array of embedded applications.
Product Features and Performance
Robust Field Programmable Gate Array technology
Integrates 598 logic blocks (LABs) and 5980 logic elements/cells
92160 total RAM bits for data storage
185 configurable I/O pins for flexible connectivity
Surface mount 256-BGA package for compact PCB design
Compatible with a 1.425V to 1.575V power supply range
Operates across a temperature range of 0°C to 85°C
Product Advantages
Offers a blend of performance and low power consumption
Provides ample logic resources for medium complexity designs
Supports a variety of digital signal processing for versatile applications
Intel's reputation for quality and reliability
Key Technical Parameters
Number of LABs/CLBs: 598
Number of Logic Elements/Cells: 5980
Total RAM Bits: 92160
Number of I/O: 185
Voltage Supply: 1.425V ~ 1.575V
Operating Temperature: 0°C ~ 85°C
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)
Quality and Safety Features
Compliance with stringent quality standards for electronic components
Operates reliably within the specified temperature range
Compatibility
Can interface with other digital components operating at compatible voltages
Appropriate for various standard PCB layouts due to common BGA package
Application Areas
Ideal for embedded processing, industrial control, automotive, and communication devices
Used in custom chip design for consumer electronics
Suitable for prototyping and educational purposes
Product Lifecycle
Currently marked as Obsolete
Consider planning for replacements or upgrades promptly
Reasons to Choose This Product
Ideal for designers needing a medium-density FPGA with balanced performance
Intel brand assures long-term support and documentation despite product being obsolete
Extensive logic resources suited for complex algorithm implementation
Easily integrated into various electronic projects with its standardized BGA package
Broad operating temperature range suitable for industrial applications