Manufacturer Part Number
5CSEMA5F31C7N
Manufacturer
Intel
Introduction
The Intel 5CSEMA5F31C7N, part of the Cyclone® V SE series, is an Embedded System On Chip (SoC) that combines advanced FPGA technology with a dual-core ARM Cortex-A9 processor.
Product Features and Performance
Dual-core ARM® Cortex®-A9 MPCore™ with CoreSight™
85K Logic Elements FPGA
Connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
64KB RAM with no dedicated Flash size
Operating speed up to 800MHz
Embedded peripherals include DMA, POR, WDT
Product Advantages
Integrated FPGA and MCU architecture for versatile application use
High-speed dual-core processor suitable for complex computing tasks
Extensive connectivity for peripheral and external device support
No external flash required, minimizing system complexity
Key Technical Parameters
Core Processor: Dual ARM® Cortex®-A9 MPCore™
Speed: 800MHz
RAM Size: 64KB
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Logic Elements: 85K in FPGA
I/O Count: MCU 181, FPGA 288
Operating Temperature range: 0°C ~ 85°C
Quality and Safety Features
Industrial standard 896-BGA packaging ensuring robustness and reliability
Operating temperature supported from 0°C to 85°C ensuring stability under various thermal environments
Compatibility
Compatible with a broad range of industry-standard peripherals and interfaces
Software support for ARM architecture allowing widespread development tool availability
Application Areas
Telecommunications
Industrial automation
Automotive systems
Military and aerospace applications
Consumer electronics
Product Lifecycle
Status: Active
Continuously supported with no near-term plans for discontinuation
Available replacements or upgrades within the Intel SoC portfolio
Several Key Reasons to Choose This Product
High integration of FPGA and dual-core CPU offers a versatile platform for numerous applications
Expansive connectivity options cater to modern device requirements
Active product lifecycle status ensures long-term availability and support
Robust packaging and reliable temperature range fit for demanding industrial applications
Backed by Intel's renowned support and development ecosystem
