Manufacturer Part Number
5CSEBA2U19C7N
Manufacturer
Intel
Introduction
The 5CSEBA2U19C7N is part of Intel's Cyclone® V SE series, an embedded System On Chip (SoC) that integrates MCU and FPGA functionalities.
Product Features and Performance
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ for efficient processing.
Features 25K Logic Elements for FPGA section.
Offers a variety of peripherals including DMA, POR, WDT.
Provides comprehensive connectivity options: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG.
Operates at a speed of 800MHz.
Product Advantages
Dual-core ARM Cortex-A9 offers high performance with low power consumption.
Integrated FPGA allows for highly flexible and customizable designs.
Wide range of connectivity options supports diverse application needs.
Packaged in a compact 484-FBGA, optimizing space on the PCB.
Key Technical Parameters
Core Processor: Dual ARM® Cortex®-A9 MPCore™
Flash Size: -
RAM Size: 64KB
Speed: 800MHz
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Number of I/O: MCU 151, FPGA 66
Quality and Safety Features
Ensures reliable operation within the 0°C ~ 85°C temperature range with built-in safety features like POR and WDT.
Compatibility
Compatible with various interfaces including CANbus, EBI/EMI, Ethernet, and more, allowing easy integration into existing designs.
Application Areas
Ideal for applications in telecommunications, automotive, industrial automation, and consumer electronics that require high performance and flexible I/O configurations.
Product Lifecycle
Currently in an active product status with no immediate plans for discontinuation. Supports longevity for ongoing and future designs.
Several Key Reasons to Choose This Product
High integration of MCU and FPGA offers versatility in design.
Powerful Dual ARM® Cortex®-A9 processors for intensive applications.
Extensive connectivity to meet a wide range of application requirements.
Intel's reputation for quality and reliability in semiconductor manufacturing.
Active product status ensures availability and support for future projects.