Manufacturer Part Number
5AGXMA3D4F31C5G
Manufacturer
Intel
Introduction
High-performance, low-power 28nm FPGA (Field Programmable Gate Array)
Suitable for embedded applications requiring reconfigurable logic
Product Features and Performance
156,000 logic elements
7 Mbits of embedded memory
416 user I/O pins
Supports DDR3, DDR3L, and LPDDR2 memory interfaces
Integrated high-speed transceivers up to 6.144 Gbps
Advanced power management features
Product Advantages
Optimized for low power consumption
Flexible and reconfigurable logic for custom hardware acceleration
Robust memory and I/O interfaces for diverse embedded applications
Key Technical Parameters
28nm process technology
Operating temperature range: 0°C to 85°C
Supply voltage: 1.07V to 1.13V
Package: 896-FBGA (31x31)
Quality and Safety Features
RoHS compliant
Supports advanced power management for energy efficiency
Compatibility
Compatible with various development tools and software from Intel
Application Areas
Embedded systems
Industrial automation
Aerospace and defense
Medical equipment
Communications infrastructure
Product Lifecycle
This product is currently in active production
Replacement or upgrade options may be available in the future
Key Reasons to Choose This Product
High-performance FPGA with abundant logic and memory resources
Low power consumption ideal for embedded applications
Flexible reconfigurable logic for custom hardware acceleration
Robust memory and I/O interfaces for diverse application needs
Compatibility with Intel's comprehensive development ecosystem