Manufacturer Part Number
5AGXBA5D4F31C5N
Manufacturer
Intel
Introduction
High-performance, power-efficient FPGA (Field Programmable Gate Array) for embedded systems
Product Features and Performance
State-of-the-art 28nm process technology
Massive logic capacity of 190,000 logic elements
Large on-chip memory of 13.2 Mbits
Extensive serial transceiver bandwidth of up to 6.375 Gbps
Advanced power management features for low power operation
Product Advantages
Flexible architecture allows customization for a wide range of applications
Powerful processing capabilities for compute-intensive tasks
Low power consumption ideal for power-constrained embedded systems
High-speed serial interfaces enable high-bandwidth data transfer
Key Technical Parameters
Package: 896-FBGA (31x31)
Operating temperature range: 0°C to 85°C
Supply voltage: 1.07V to 1.13V
384 user I/O pins
8,962 LABs (Logic Array Blocks)
Quality and Safety Features
RoHS compliant design
Rigorous testing and quality control processes
Compatibility
Compatible with a wide range of embedded systems and applications
Application Areas
Industrial automation and control
Medical equipment
Telecommunications infrastructure
Military and aerospace systems
Video and image processing
Product Lifecycle
Currently in active production
No immediate plans for discontinuation
Newer and more advanced FPGA models available as potential upgrades
Key Reasons to Choose This Product
Exceptional performance and logic capacity for demanding embedded applications
Low power consumption and advanced power management features
Flexible architecture and comprehensive toolset for custom design implementation
Proven reliability and quality backed by Intel's reputation
Broad compatibility and suitability for a wide range of embedded systems
5AGXBB1D4F35C5GIntelIC FPGA 544 I/O 1152FBGA