Manufacturer Part Number
5AGXBA1D4F27C5G
Manufacturer
Intel
Introduction
High-performance, low-power FPGA (Field Programmable Gate Array) for embedded applications
Product Features and Performance
75,000 logic elements for advanced logic and signal processing
66 million total RAM bits for flexible on-chip memory
3,537 LABs (Logic Array Blocks) for high logic density
Supports operating temperature range of 0°C to 85°C
Product Advantages
Flexible and reprogrammable hardware platform
Optimized for power-constrained embedded systems
Extensive on-chip memory for data buffering and processing
Scalable performance and resources
Key Technical Parameters
Package: 672-FBGA (27x27), 672-BBGA, FCBGA
Mounting Type: Surface Mount
Supply Voltage: 1.07V to 1.13V
I/O Count: 336
Quality and Safety Features
RoHS compliant
Reliable and durable design
Compatibility
Designed for use in a wide range of embedded systems and applications
Application Areas
Industrial control and automation
Medical equipment
Telecommunications infrastructure
Military and aerospace systems
Automotive electronics
Product Lifecycle
This product is currently in active production
Replacement or upgrade options may be available in the future
Key Reasons to Choose This Product
High-performance FPGA with flexible logic and memory resources
Optimized for power-constrained embedded applications
Reliable and RoHS-compliant design
Broad compatibility and suitability for diverse application areas
Ongoing product support and potential for future upgrades