5AGTFD3H3F35I3G - Intel

Manufacturer Part Number

5AGTFD3H3F35I3G

Manufacturer

Intel

Introduction

High-performance programmable logic device from Intel's Arria V GT series, suitable for a variety of embedded applications.

Product Features and Performance

High-density integration with 362,000 logic elements

17,110 logic array blocks (LABs)

Large memory capacity with 19,822,592 total RAM bits

Robust I/O count of 544 for comprehensive connectivity

Optimal power supply voltage range of 1.12V to 1.18V

Designed for surface mount technology

Extended operating temperature range from -40°C to 100°C

Packaged in a 1152-Ball Fine-Pitch Ball Grid Array (FCBGA)

Product Advantages

Offers high flexibility due to reprogrammability

Accommodates complex logic functions and high-speed digital signal processing

Provides ample storage for demanding applications

Suitable for high-speed interfaces given its substantial number of I/Os

Ensures reliable operation in a wide range of environmental conditions

Enables compact hardware design owing to high integration density

Key Technical Parameters

LABs/CLBs: 17,110

Logic Elements/Cells: 362,000

Total RAM Bits: 19,822,592

Number of I/O: 544

Supply Voltage Range: 1.12V ~ 1.18V

Mounting Type: Surface Mount

Operating Temperature Range: -40°C ~ 100°C

Package/Case: 1152-BBGA, FCBGA

Supplier Device Package: 1152-FBGA, FC (35x35)

Quality and Safety Features

Complies with stringent industrial quality and safety standards

Integrated temperature sensors for thermal management

Built-in voltage sensors for power supply monitoring

Compatibility

Compatible with various development and debugging tools offered by Intel and third-party providers

Supportive of multiple design methodologies

Application Areas

Telecommunications

Data processing

Industrial automation

Medical electronics

Military and aerospace

Product Lifecycle

Currently active with no near-term discontinuation risk

Supported by Intel with potential future upgrades

Several Key Reasons to Choose This Product

Intel's reputation for reliability and support

Advanced feature set provides capabilities for future-proofing designs

Reduces the need for additional components due to high integration

Broad compatibility reduces development time

Suitable for rugged environments with its wide operating temperature range

Long-term availability backed by an established semiconductor supplier