Manufacturer Part Number
10M08SCU169I7G
Manufacturer
Intel
Introduction
Integrated Circuit (IC)
Embedded FPGA (Field Programmable Gate Array)
Product Features and Performance
RoHS compliant
169-UBGA (11x11) package
169-LFBGA package
Surface mount
Operating temperature range: -40°C to 100°C (TJ)
MAX 10 series
169-UBGA (11x11) supplier device package
Tray packaging
130 I/O count
8000 logic elements/cells
387,072 total RAM bits
500 LABs/CLBs
Supply voltage range: 2.85V to 3.465V
Product Advantages
Versatile FPGA solution for embedded applications
Wide operating temperature range
Compact and efficient package options
High-performance logic and memory capabilities
Key Technical Parameters
Integrated Circuit (IC) type: Embedded FPGA
Package: 169-UBGA (11x11), 169-LFBGA
Mounting Type: Surface Mount
Operating Temperature Range: -40°C to 100°C (TJ)
I/O Count: 130
Logic Elements/Cells: 8000
Total RAM Bits: 387,072
LABs/CLBs: 500
Supply Voltage: 2.85V to 3.465V
Quality and Safety Features
RoHS compliant
Compatibility
Suitable for a wide range of embedded applications
Application Areas
Embedded systems
Industrial automation
Robotics
Aerospace and defense
Communications
Medical equipment
Product Lifecycle
Current product, not nearing discontinuation
Replacement and upgrade options available from Intel
Key Reasons to Choose This Product
Versatile FPGA capabilities for embedded applications
Wide operating temperature range for harsh environments
Compact and efficient package options for space-constrained designs
High-performance logic and memory resources
RoHS compliance for environmental sustainability
Supported by Intel's extensive ecosystem and technical resources